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11th International Conference on Electronic Materials and Packaging (EMAP 2009)
Conference in-person 1st to 3rd December 2009 Penang, Malaysia Website: http://mechanical.eng.usm.my/EMAP2009 Contact person: Abdul Mujeebu and Khalil Abdullah The objective of this conference is to establish an international forum of experts and researchers for the exchange, dissemination and discussion of state-of-the-art technologies and recent developments in electronic materials & packaging. Organized by: Universiti Sains Malaysia and CPMT society of IEEE Deadline for abstracts/proposals: 30th June 2009 Check the event website for more details. View all events from this organizer.
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