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InterPACK (International Conference on Electronics Packaging)
Conference in-person 6th to 9th July 2015 The Fairmont San Francisco Hotel, 950 Mason Street, San Francisco, CA, 94108, United States, United States of America Website: http://atnd.it/26346-0 Contact person: Amanda Aslan This is the first time that the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Time: 06:00 - 20:00 Price: USD845 - USD995 Organized by: American Society of Mechanical Engineers (ASME) Deadline for abstracts/proposals: 5th July 2015 Check the event website for more details. View all events from this organizer.
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